TOTA / wafer level testing

Afore has developed a test method called TOTA(Test On TApe). TOTA makes it possible to use same test equipments for WLP(Wafer Level Package) and singulated components. TOTA method is the first and only method that has 0% jam rate.


Strip / Lead frame level testing

Increasing production volumes and requirements for lower test costs drives MEMS manufacturers to seek for more efficient testing methods. To add parallelism in testing is a good way to raise efficiency. One of Afore’s answer to this is lead frame level testing. Our lead frame level handlers have worked in high volume production almost a decade and proven their feasibility.

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