Wafer level testing
Wafer level packaging (WLP) is a technique which will, in the near future, change the MEMS sensor market tremendously. Especially in the field of consumer electronics WLP –products will substitute a lot of the traditionally packaged sensors.
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Strip/Lead frame level testing
Decreasing component prices set also pressure to the testing costs. One way to response to this is to perform the testing in strips or lead frames. Testing of multiple components simultaneously gives high throughput and thus declines investment cost.
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