Dual Row

DIP, TSSOP, SOIC - "Gull wing packages"

Package types like DIP, TSSOP, SOIC, have ”gull wing” leads for contacting. Typically the leads have to be supported for accurate and successfull contacting.

When singulated, the DUTs are placed on carriers and can be tested with strip level test cell APOLLON. With APOLLON  these type of packages may be tested also un-singulated in lead frame (strip) level and singulated after testing.

Related products

APOLLON is a tri-temp strip level test system for motion sensors.