TOTA / WAFER LEVEL TESTING

Afore has developed a test method called TOTA(Test On TApe). TOTA makes it possible to use same test equipments for WLP(Wafer Level Package) and singulated components. TOTA method is the first and only method that has 0% jam rate.

WLP is a technique which will, in the near future, change the MEMS sensor market tremendously. Especially in the field of consumer electronics WLP –products will substitute a lot of the traditionally packaged sensors.

Meanwhile waiting new package types from R&D, sensor manufacturers are able to use TOTA equipments for conventional singulated packages. As long as the component top is flat it can be easily placed on the tape to optimum pattern and tested with TOTA equipment.

The use of TOTA gives several benefits:

1. Zero jam rate!
2. TOTA enables high parallelism in testing without complex and expensive carriers or test socket boards.
3. The positioning differences between tests are eliminated which is leading to high repeatability and stimulus accuracy.
4. Product change for the TOTA handlers is easy and fast compared to conventional handlers. The tape frame type can remain the same when the product type or package changes. There are no product specific mechanical changes needed (example: track pars).
5. There is no need for handling a single component (for example pick and place) so yield loss is history no matter how many test cycles are needed.
6. All of above together -> extreme low cost per test!

Kronos is our TOTA handler for accelerometer and yaw rate sensors with infinite turn angle. Aiolos is for pressure sensors. Please find more information by clicking the links beside.

Afore is a pioneer in wafer level testing. The first pressure sensor prober was delivered over 10 years ago and now Afore is among the first who can present a wafer level testing equipment for motion sensors with real stimulus.