QFN, LCC, BGA, LGA
Flat package types like QFN, LCC, BGA, LGA that have contact pads can be tested in singulated form in strips or in diced strips.
Testing of QFN, LCC, BGA, LGA packages is also possible with wafer level test system. In this case the strips are placed on film frame for testing, before or after dicing. Film frame size up to 8” are applicable for KRONOS and AIOLOS systems.